bonder

(redirected from Bonders)
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bond·er

 (bŏn′dər)
n.
1. One that bonds.
2. See header.

bonder

(ˈbɒndə)
n
(Building) a long stone or brick laid in a wall as a header. Also called: bondstone
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References in periodicals archive ?
Henkel has introduced Loctite HY 4090 and Loctite HY 4080 GY Universal Structural Bonders, innovative adhesives powered by a patented Hybrid technology that combines the most critical attributes of structural and instant adhesives bond strength, speed and durability.
The new lab features an array of state-of-the-art process equipment, including flip chip bonders and plasma cleaners.
With Spin Coaters and Mask Aligners for imaging, Lift-off Tools for essential material processing, Substrate Bonders for mounting, Probers for testing, and Device Bonders for assembling SUSS provides the most influential range of production equipment for MEMS processing and testing.
representative for Meiki injection presses and Origin uv lacquer bonders), introduced The UV Flashlight DVD Bonder.
Bonders accomplished the manual functions of alignment with motors, microprocessors, memories, cameras and monitors, leading up to vision systems.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders and a broader range of expendable tools to its core ball bonding products.
Henkel has introduced Loctite Universal Structural Bonders, innovative adhesives powered by a patented Hybrid technology that combines the most critical attributes of structural, instant and epoxy adhesives bond strength, speed and durability.
The problems that will be encountered in this type of application are virtually insurmountable without using either a special viewing feature on semiautomatic laser bonders or the automatic pattern recognition capability found on more expensive fully automatic bonders.
With over 6,000 systems installed, SUSS products include coating and developing systems, proximity lithography systems, substrate bonders, flip chip bonders and probe systems.
Palomar Technologies (formerly part of Hughes Aircraft Company) is the world's foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers.
SUSS MicroTec Wafer Bonders Continue to Capture Major Market Share in Advanced MEMS Manufacturing
The fastest growing division of the SUSS MicroTec group, the Bonder Division develops and manufactures wafer bonders for high-volume MEMS and Semiconductor markets.