CTE

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CTE

abbr.
chronic traumatic encephalopathy
References in periodicals archive ?
The CSP/MicroBGA socket family accommodates various CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices.
Prototyping, testing, and burning in CSP (chip scale package), BGA (ball grid array), microBGA, and LGA (land grid array) devices, Aries Electronics' CSP/BallNest ZIF-style hybrid socket operates in devices with a 0.
4 mm, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.
5 mm in applications with speeds from 1 GHz to over 10 GHz, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.
The system, based on the OptiCon series from GOEPEL, provides automatic recognition of shorts and solder bridges, as well as missing solder balls on ball grid array (BGA) and microBGA devices.
The ATL25/ATC25 is offered in a variety of package types including; MicroBGA, ChipScale BGA, TQFP, PQGP and other thermal enhanced packages.
Note: Tessera, MicroBGA, Compliant Chip, MicroZ and the Tessera logo are registered trademarks of Tessera, Inc.
The socket features a standard molded format suitable for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices with a pitch of 0.
Specific applications for this test socket include CSP, MicroBGA, MLF, QFN, DSP, LGA, SRAM, DRAM and Flash devices.
The relationship with Feinfocus will give Palomar the ability to conduct real-time inspection of assemblies that include chip-on-board, bond wires, ball grid array (BGA), microBGA and flip chip components, as well as other applications where precise measurement is required.