integrated circuit

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in·te·grat·ed circuit

(ĭn′tĭ-grā′tĭd)
n. Abbr. IC
An electronic circuit whose components, such as transistors and resistors, are etched or deposited on a single slice of semiconductor material to produce a chip.

integrated circuitry n.

integrated circuit

n
(Electronics) a very small electronic circuit consisting of an assembly of elements made from a chip of semiconducting material, such as crystalline silicon. Abbreviation: IC

in′tegrated cir′cuit


n.
a circuit of transistors, resistors, and capacitors constructed on a single semiconductor wafer or chip, in which the components are interconnected to perform a given function; microcircuit. Abbr.: IC
[1955–60]

in·te·grat·ed circuit

(ĭn′tĭ-grā′tĭd)
A device made of interconnected electronic components that are etched or imprinted onto a tiny slice of a semiconducting material, such as silicon or germanium. An integrated circuit smaller than a fingernail can hold millions of circuits. Also called chip.

integrated circuit

1. A tiny electrical circuit that is made up of a semiconductor chip with several electronic components.
2. A minute electrical circuit containing thousands of electronic components on a tiny chip of silicon.
ThesaurusAntonymsRelated WordsSynonymsLegend:
Noun1.integrated circuit - a microelectronic computer circuit incorporated into a chip or semiconductorintegrated circuit - a microelectronic computer circuit incorporated into a chip or semiconductor; a whole system rather than a single component
micro chip, microchip, microprocessor chip, silicon chip, chip - electronic equipment consisting of a small crystal of a silicon semiconductor fabricated to carry out a number of electronic functions in an integrated circuit
computer circuit - a circuit that is part of a computer
Translations
circuit intégré
integrált áramkör
circuito integrado

integrated circuit

integrated circuit

n (Comput) → circuito integrato
References in periodicals archive ?
Due to the absence of the mounting hole the TO-247PLUS package may accommodate a 70% larger silicon die area compared to standard TO-247.
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To be able to reach these price points TOE designs must keep the amount of logic small, to reduce the silicon die size, and avoid using a high clock frequency, which would require an advanced, and thus expensive, fabrication process.
The combination of a multi-mode architecture, minimal on-chip memory requirements (In8Stream(TM) shares host system memory and does not require external memory), and reduced silicon die size (Parthus estimates In8Stream(TM) designs are less than half the size of multi-protocol implementations) translates into a significant reduction in costs for 802.
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