warpage


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warpage

[ˈwɔːpɪdʒ] n (Textiles) → orditura
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The warpage degree of printed products is tested using the 3DP flexural testing specimens with a dimension of 80 x 10 x 4 mm.
is a paper from Henkel Senior Scientist Jay Chao called Ultra-Low Warpage Liquid Compression Molding (LCM) Development for Advanced Wafer-Level Packaging.
Abstract: Warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated.
This is considered the "cardinal rule" and is intended to help address mold filling, packing, shrinkage, residual stress and warpage issues.
The purpose of this application is to study the effect of process parameters on warpage deflection in dumbbell plastic part.
A Warpage can be a problem, especially if the person doing the work is not experienced and does not employ good technique and procedure.
For the first time, an international standards organization addresses local area PCB warpage across reflow profile temperatures.
in [3] consider the application of computer-aided engineering integrated with statistical techniques in order to reduce warpage variation depended on injection molding process parameters during production of thin-shell plastic components.
Additionally, new features compensate for PCB warpage and support automatic stability control of the image sequence.
Taisol was looking for an improved material that could reduce warpage in their 5-in-1 memory card connectors.