reflow

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reflow

(riːˈfləʊ)
vb (intr)
to flow again
Collins English Dictionary – Complete and Unabridged, 12th Edition 2014 © HarperCollins Publishers 1991, 1994, 1998, 2000, 2003, 2006, 2007, 2009, 2011, 2014
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References in periodicals archive
Their experiment showed that while mean level of serotonin in thrombocytes in patients with reflow was 476 [+ or -] 208 ng/109 thrombocytes, it was 542 [+ or -] 273 ng/109 thrombocytes in patients with no-reflow.
The reflow oven has four zones and short length, but no issues around reflow quality were seen as a result.
Manufacturers who implement pre-reflow optical inspection generally fall into one of four groups: those who build wireless products with RF shields, which typically are applied before the reflow oven and prevent 100% post-reflow optical inspection; those who build high-reliability products and need to do it right the first time; new product introduction centers that need to get paste-and-placement equipment up and running quickly and efficiently for each new board type; and those who believe that earlier detection and prevention will improve yields.
Ball mounting on wafer or BGA employs printing or pin-transfer flux deposition, followed by ball placement and reflow. Converting to lead-free solders results in a higher ball missing rate or misalignment rate due to the poorer wetting of lead-free alloys.
It is important to know how much, if any, of the paste slumps like butter on a hot day during reflow. If solder paste does slump, it can lead to shorts, solder balls or solder beads, or cause variations in solder joint volume on selected joints.
Immersion tin shows solderability degradation after exposure to multiple heat cycles, as in a top- and bottom-side PCBA reflow process.
Yet to ensure a good metallurgical and mechanical attachment, the common element for all reballing methods is the need to reflow solder balls while aligned on the BGA lands.
"No reflow" sikligi rotablator aterektomi kullanilmasi durumunda daha yuksek olup (1.2-9.0%) genellikle reverzibldir (15,16) "No-reflow" acil PKG uygulanan 1919 hastanin incelendigi ve "no-reflow" un girisim yeri ve proksimalinde bir okluzyon olmaksizin TIMI akimin 3.
Therefore, it is important to clearly identify the component and its package to determine whether or not it can resist the higher reflow temperatures necessitated by lead-free.
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