chemical plating

chemical plating

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The substrates are metallized by either the electroless or dynamic chemical plating (DCP) method.
Another form of metallizing nonconductor substrates is the dynamical chemical plating (DCP) method, (17) which is a wet deposition technique that has been shown to be a good alternative for producing deposits of single metals such as Cu, Ni, and Ag.
This is why bag filters were often chosen for chemical plating applications.
The company professionally provides all kinds of nickel, copper, cobalt salts and nonferrous metal products for plating, chemical plating, battery materials and metallurgy.
The company produces nickel, copper, cobalt salts and nonferrous metal products for plating, chemical plating, battery materials and metallurgy.
In the semiconductor industry, Partek products are designed for use in both semiconductor process equipment and fabrication facilities, including important applications such as chemical mechanical polishing (CMP), electro chemical plating (ECP) and wet cleaning.
AAMI will accomplish the increase in its product line based on its expansion of operations to two (2) shifts, completion of construction of its new chemical plating facility, and its continual upgrading of manufacturing equipment.