has created two communication silicon architectures aimed at speeding the development of new communication equipment and wireless clients that address the opportunities emerging from the convergence of voice and data networks.
Recent events have given Grove and Intel
, the world's dominant manufacturer of chips for personal computers, a raft of crisis points to exploit.
In one of the biggest advancements in fundamental transistor design, Intel
Corporation today revealed that it is using two dramatically new materials to build the insulating walls and switching gates of its 45 nanometer (nm) transistors.
11n Wi-Fi specification, the Intel
Next-Gen Wireless-N technology addresses that need by offering users up to five times(b) the performance and twice the wireless range - while providing up to an extra hour of notebook battery life when compared to existing Draft-N products.
Core 2 Quad processor packs four brains in every PC and delivers the immense speed and responsiveness that is increasingly required to process today's most demanding media-intensive applications.
SAN FRANCISCO -- Today Intel
Corporation disclosed details of its next-generation Intel
([R]) Centrino([R]) Duo mobile technology platform that will enable laptops to operate faster and with enhanced wireless communication capabilities.
Looking to evolve the "big, beige box" and help bring to market more stylish, small, quiet and cool-running PCs perfect for any room in the home, Intel
announced the Intel
[R] Core[TM] Processor Challenge.
Based on the revolutionary Intel
[R] Core[TM] microarchitecture, these two Intel
dual-core processors expand the portfolio of high-performance, power efficient solutions with long life cycle support for 5 to 7 years for its embedded customers.
It will feature a dramatic 70 percent performance improvement over today's Intel
Core2 Extreme processor.
Major computer makers around the world today began introducing new desktop PCs with Intel
vPro technology for the mainstream business market with more systems available in the coming weeks and months from all leading manufacturers.
More than 200 Intel
Centrino Duo mobile technology-based designs from PC manufacturers, resellers and integrators around the world will incorporate the new Intel
Core 2 Duo processor (formerly codenamed "Merom") this year.
The US$2 billion factory has begun high-volume production using 65nm process technology produced on the industry's largest wafer size (300mm), which provides the Intel
fab with the potential to generate the world's highest microprocessor output at the lowest cost.