Rumors have suggested that the manufacturing difficulties with HBM2 have centered around the interposer
- specifically, the difficulty of aligning and connecting the through-silicon vias that run through the memory stacks and into the interposer
itself before connecting with the GPU.
Conceivably an entire conventional circuit board with a variety of different but full-sized chips could be shrunk down onto a much smaller interposer
hosting a huddle of yet far smaller chiplets.
A number of companies are considering this large-body version of FO-WLP as a lower-cost alternative to a high-density silicon interposer
Both firms have agreed to work jointly to deliver standalone TSV wafers and integrated TSV solutions with metal layers for interposer
and redistribution layers.
He said the company has demonstrated integrated capacitors on an interposer
, thermal interface materials, and micro-bumps.
continue to gain momentum as an interposer
The spring protrudes from the interposer
set bottom, while the probe protrudes from the top.
which owns cutting-edge via-fill technology for interposer
substrate, to realize next-generation semiconductor packaging products using ultra-thin glass.
The Triton technology is designed to form electrodes in ultra-thin glass interposer
substrates for next-generation semiconductor chips for mobile devices.
Xilinx SSI technology utilizes microbumps fabricated on the 28nm FPGA die to interface to a silicon interposer
built using low-risk, high-yield 65nm technology.
Singapore, Dec 6, 2011 - (JCN Newswire) - The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer
Unfortunately, thermal contact resistance, which limits conduction between the chip and interposer
, together with limitations to effective cooling of the interposer
at its edges or the outside surfaces of a chip stack package, erodes the performance of this approach.