interposer


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in·ter·pose

 (ĭn′tər-pōz′)
v. in·ter·posed, in·ter·pos·ing, in·ter·pos·es
v.tr.
1.
a. To insert or introduce between parts: The ice interposes a barrier between the harbor and the islands.
b. To place (oneself) between others or things.
2. To introduce or interject (a comment, for example) during discourse or a conversation. See Synonyms at introduce.
3. To exert (influence or authority) in order to interfere or intervene: interpose one's veto.
v.intr.
1. To come between things; assume an intervening position.
2. To come between the parties in a dispute; intervene.
3. To insert a remark, question, or argument.

[French, from Old French interposer, to intervene, alteration (influenced by poser, to put, place) of Latin interpōnere, to put between : inter-, inter- + pōnere, to put; see apo- in Indo-European roots.]

in′ter·pos′al n.
in′ter·pos′er n.
in′ter·po·si′tion (-pə-zĭsh′ən) n.
References in periodicals archive ?
5D interposer packages: system-level evaluation of several different case scenarios, analyzing the expected cost decrease trend over five years
The AMD Radeon(TM) R9 Fury X GPU utilizes UMC's TSV process technology and die-stacking to fuse HBM DRAM with AMD's GPU on a silicon interposer, enabling the GPU to deliver unmatched memory bandwidth of 4096-bit and quadruple the performance-per-watt over the current GDDR5 industry standard.
Emerging applications, such as photonics based on interposer, are also being developed for future products.
Today's silicon interposer recalls the silicon interposer technology introduced during the 1990s.
5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries.
5D component integrates HBM memories (DRAM dies & Logic dies connected with via-middle TSV and micro-bumps) and GPU stacked onto a silicon interposer (including also via-middle TSV).
Interposer, Stoppling, Saddle Stiching, Perfect Binding, Booklet Tnmmcr/
The high power thermal test die was first assembled on a silicon interposer with through silicon vias and connected to the substrate, which was followed by the overmolding and back-grinding processes to form the partially molded (PM) package with exposed die for direct heat sink attachments.
Organic interposers continue to gain momentum as an interposer option.
which owns cutting-edge via-fill technology for interposer substrate, to realize next-generation semiconductor packaging products using ultra-thin glass.
The Triton technology is designed to form electrodes in ultra-thin glass interposer substrates for next-generation semiconductor chips for mobile devices.
An interposer connects silicon memory chips and printed-circuit boards with electrodes.