Amic acid

(Chem.) one of a class of nitrogenized acids somewhat resembling amides.

See also: Amic

Webster's Revised Unabridged Dictionary, published 1913 by G. & C. Merriam Co.
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After the formation of amic acid linkages between maleic anhydride units of PSMA and three aromatic amines (AS, AIPA, and 6FAL), a free radical polymerization inhibitor (BHT) and a chemical imidization agent (acetic anhydride; 10 mL) were added and the reaction mixture was reacted for 4.5 h at 100 [degrees]C to afford side-chain polyimides (PSI-x) [12] (Figure 2).
Designed as an alternative to polymers that are water-soluble only in high-pH, alkaline solutions, these SMA 1000MA amic acid resins are said to eliminate the tarnish typical with bronze and copper dispersion while producing a pigment with "true metallic color."
This resin contains amic acid functionality, groups that are possible to form only with anhydride-containing resins.
The most used method for the synthesis of aromatic polyimides via soluble poly(amic acid) precursors has disadvantages connected with the low stability of the poly(amic acid) solutions and incomplete cyclization of the poly(amic acid)s to polyimide structures (1), (2).
An amic acid modfiled base resin is nonionic in nature and is soluble at a pH of 7.
The poly(amic acid) (PAA) precursor solution was prepared through poly-condensation reaction between BPDA and PDA in NMP.
Poly (amic acid) (PAA) hybrids with organically modified montmorillonite (Cloisite 30B) were synthesized from N, N'-dimeihylacelamide (DMAc) solution.
The hybrid films were prepared using a poly (amic acid) having phthalide groups and tetraethoxysilane via solgel technique and thermal cyclodehydration.
Therefore, the processing of the polyimides is generally carried out via soluble poly(amic acid) precursors, which are cast onto various substrates, and then they are converted into polyimide films by thermal treatment.
In this novel process, termed solid-state powder foaming by the authors, poly(amic acid) (PAA) precursor powders are prepared by reacting aromatic diacid-diesters with aromatic diamines in the presence of a hydrogen bonding solvent (e.g., tetrahydrofuran, THF and methanol, MeOH).
Polyimide foams and microstructures discussed in the present work were obtained by thermal treatment of poly (amic acid) solid phase precursor powders containing solvents that act as BAs [1-4].