ultrasonic welding

(redirected from Ultrasonic bonding)
Also found in: Encyclopedia.

ultrasonic welding

n
(General Engineering) the use of high-energy vibration of ultrasonic frequency to produce a weld between two components which are held in close contact
References in periodicals archive ?
This project will focus on the collective development of novel ultrasonic bonding equipment and innovative stretch fibers for the construction of stretch laminates, without the use of hot melt elastic attachment adhesives.
The variables studied included aluminum pad properties, capillary geometry, bond pad design (aluminum pad thickness, aluminum pad coated with nickel layer), and the effect of ultrasonic bonding power.
The In and Sn-3Ag layers have much lower melting temperatures than the base material (Cu) and can be melted through the heat generated during ultrasonic bonding, forming intermetallic compounds (IMCs).
For example, with ultrasonic bonding used on a continuous web, it is easy to stop the line for a problem, but with heat welding, the engaged knives would continue to melt the plastic during a stop.
A high degree of reliability in the heat cycle is ensured through the application of powerful ultrasonic bonding technology
The IGBT modules integrate a sixth-generation V-IGBT chip to achieve low power loss, and feature a high degree of reliability in the heat cycle by utilizing ultrasonic bonding technology.
The ultrasonic bonding ability of the Rotosonic machine--the latest creation from Herrmann Ultrasonics--is up to 10 times faster than sewing or gluing processes, according to the Bartlett, IL-based company.
Enables automated deposition and is compatible with thermal compression and ultrasonic bonding processes.
It works well with ultrasonic bonding, spin welding, adhesive bonding, and heat-staking.
The system ordered encompasses an ultrasonic bonding head and a high force bonding head equipped with a confinement chamber that reduces oxide on bumps and bonding pads.
To ensure that Sonobond's equipment satisfies specific requirements, it offers a free, no-obligation ultrasonic bonding viability test to produce sample assemblies with companies' nonwoven or synthetic fabrics.
The IC tag inlay will be produced by applying a propritary ultrasonic bonding technology.