The test results of the Group A rocks show that the shear wave velocity and dynamic Young's modulus
are correlated with grain size through positive linear relationships.
The Young's modulus
and shear modulus of solid wood (Sitka spruce, Picea sitchensis), medium-density fiberboard (MDF), and Lauan wood (Shorea sp.
Where Ei and i are the Young's modulus
and Poisson coefficient of the indenter and the Poisson coefficient of the tested sample.
The important bone properties are Young's modulus
, tensile strength, static strength, Poisson's ratio, shear modulus, fatigue strength etc.
It features high bending workability and a low Young's modulus
made possible by Furukawa Electric's proprietary metal structure control technologies.
As such, this value is the slope of the stress-strain curve in the linear region of the curve and is sometimes referred to as the tangent modulus or Young's modulus
d] is dynamic Young's modulus
, [rho] is density of the studied sample, [v.
As a result, the Young's modulus
determined by the 3PB test is lower than that determined by nanoindentation.
methods; one for measuring Young's modulus
(5) and one for
density, modulus of rupture, and Young's modulus
in general were higher moving horizontally from the core toward the edge .
Topics covered by the volume's 15 original papers include a new method to determine the Young's modulus
of a microcrystal based upon Raman spectrometry, solid-state reaction in an Al-Fe binary system induced by mechanical alloying, thermal behavior of xenon in a refractory metal for gas fast reactor fuel elements, molecular dynamics simulation of brittle fracture in BCC iron, growth kinetics of boride layers, structure and optical properties of magnetron-sputtered SiOx layers with silicon nanoparticles, reaction of iron with amorphous silicon and crystalline silicon for the fabrication of iron silicides, theoretical determination of the pressure-volume-temperature relationship of some alkali halides, and concentration micro-field for lamellar eutectic growth.
Thus, a greater Young's modulus
of the underfill created a greater underfill stress, resulting in longer electromigration life.