encapsulant

Also found in: Medical.

en·cap·su·lant

(ĕn-kăp′sə-lənt)

A material used for encapsulating.

References in periodicals archive ?

Corner bond or underfill is a fluid encapsulant that fills the gap between the component and the PCB to provide a strong mechanical bond, and to relive stress between fragile interconnections.

Transcend Recommends Corner Bond and Underfill to Increase Reliability for its Embedded Products

The Group's two new encapsulant production lines have commenced production and enhanced the production capability of the Group significantly.

Niche-Tech Group Limited Announces 2019 Interim Results

ENGAGE PV Polyolefin Resins are a family of high performance resins designed for photovoltaic (PV) encapsulant films.

Improving PV Solar Systems: THE DOW CHEMICAL COMPANY

In this process, a bead of non-sag silicone is applied to the module to create a dam around the encapsulation area, which is then filled with a low viscosity encapsulant such as a platinum-catalysed silicone gel.

WACKER Elastosil [R] N9111 Tin Free Silicone from Intertronics Avoids Conflicting Chemistries and Speeds Assembly Time

Even when stored at these temperatures, the encapsulant on the sensor does not display any stress cracks.

Bonding sensors in the car: this article discusses several automotive sensor adhesives and their thermal, mechanical, and chemical requirements

8(a), the luminous flux values of LED chips increased with the increase of encapsulant's RI.

Highly transparent thermal stable silicone/titania hybrids with high refractive index for LED encapsulation

In addition, cracks in the encapsulant form pathways to the carbon pores.

Controlling bad odors

It has a high viscosity but remains flowable and can be used as an adhesive, sealant, coating and encapsulant in sections up to 1/8"-thick.

LED-curable system meets biocompatibility specifications

Therefore, a method was devised to selectively remove the encapsulant without affecting the fragile element, thus permitting further detailed inspection.

Circuits disassembly: materials characterization and failure analysis: a systematic approach to nonconventional methods of encapsulant removal

The rh in PV modules depends on their ambient climate, material (encapsulant, back sheet) properties, and the operation conditions.

Effect of temperature and humidity on the degradation rate of multicrystalline silicon photovoltaic module

Tokyo, Oct 5, 2013 - (JCN) - Kuraray, through joint research with the National Institute of Advanced Industrial Science and Technology (AIST), has developed high-durability encapsulant polyvinyl butyral (PVB) films that help to make photovoltaic(PV) modules lighter and less expensive, and has begun sampling them in test markets.

Kuraray, AIST Create PVB Film to Make Photovoltaic Modules Lighter and Less Expensive

(SeeNews) - Nov 9, 2012 - US solar encapsulant maker STR Holdings Inc (NYSE:STRI) swung to a net loss from continuing operations of USD 3.6 million (EUR 2.8m) in the third quarter of 2012 as sales plunged.