Corner bond or underfill is a fluid
encapsulant that fills the gap between the component and the PCB to provide a strong mechanical bond, and to relive stress between fragile interconnections.
The Group's two new
encapsulant production lines have commenced production and enhanced the production capability of the Group significantly.
In this process, a bead of non-sag silicone is applied to the module to create a dam around the encapsulation area, which is then filled with a low viscosity
encapsulant such as a platinum-catalysed silicone gel.
8(a), the luminous flux values of LED chips increased with the increase of
encapsulant's RI.
In addition, cracks in the
encapsulant form pathways to the carbon pores.
Therefore, a method was devised to selectively remove the
encapsulant without affecting the fragile element, thus permitting further detailed inspection.
The rh in PV modules depends on their ambient climate, material (
encapsulant, back sheet) properties, and the operation conditions.
Tokyo, Oct 5, 2013 - (JCN) - Kuraray, through joint research with the National Institute of Advanced Industrial Science and Technology (AIST), has developed high-durability
encapsulant polyvinyl butyral (PVB) films that help to make photovoltaic(PV) modules lighter and less expensive, and has begun sampling them in test markets.
(SeeNews) - Nov 9, 2012 - US solar
encapsulant maker STR Holdings Inc (NYSE:STRI) swung to a net loss from continuing operations of USD 3.6 million (EUR 2.8m) in the third quarter of 2012 as sales plunged.