interposer


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in·ter·pose

 (ĭn′tər-pōz′)
v. in·ter·posed, in·ter·pos·ing, in·ter·pos·es
v.tr.
1.
a. To insert or introduce between parts: The ice interposes a barrier between the harbor and the islands.
b. To place (oneself) between others or things.
2. To introduce or interject (a comment, for example) during discourse or a conversation. See Synonyms at introduce.
3. To exert (influence or authority) in order to interfere or intervene: interpose one's veto.
v.intr.
1. To come between things; assume an intervening position.
2. To come between the parties in a dispute; intervene.
3. To insert a remark, question, or argument.

[French, from Old French interposer, to intervene, alteration (influenced by poser, to put, place) of Latin interpōnere, to put between : inter-, inter- + pōnere, to put; see apo- in Indo-European roots.]

in′ter·pos′al n.
in′ter·pos′er n.
in′ter·po·si′tion (-pə-zĭsh′ən) n.
American Heritage® Dictionary of the English Language, Fifth Edition. Copyright © 2016 by Houghton Mifflin Harcourt Publishing Company. Published by Houghton Mifflin Harcourt Publishing Company. All rights reserved.
References in periodicals archive ?
CEA Leti and STMicroelectronics detailed research on a new 3-D architecture using chiplets on an active interposer. TSMC presented its system on integrated chips (SoIC) process for 3-D heterogeneous integration, in which an active wafer is used instead of a passive interposer.
Rumors have suggested that the manufacturing difficulties with HBM2 have centered around the interposer - specifically, the difficulty of aligning and connecting the through-silicon vias that run through the memory stacks and into the interposer itself before connecting with the GPU.
Both firms have agreed to work jointly to deliver standalone TSV wafers and integrated TSV solutions with metal layers for interposer and redistribution layers.
is proud to bring its FinFET ASIC and interposer design skills along with our
Specifically, Smoltek's Tiger carbon-nano-structure-based assembly platform supports stacking bare dies on each other or bonding them to a substrate (interposer) or carrier (lead frame) using arrays of nano-structure-enabled metallic pillars.
Organic interposers continue to gain momentum as an interposer option.
The probes and springs are contained in an "interposer set" that is machined to match the device footprint.
In particular, mobile communications applications, whose functions are increasingly complex yet whose sizes must not be increased, several emerging 3D SiPs (e.g., package on package (PoP), wire-bonded stacked chips and silicon interposer) have been extensively adopted in recent years [1, 2].
* 3D Interposer development combining new assembly performances for ultra-miniaturization.
(Arizona, U.S.), which owns cutting-edge via-fill technology for interposer substrate, to realize next-generation semiconductor packaging products using ultra-thin glass.
The Triton technology is designed to form electrodes in ultra-thin glass interposer substrates for next-generation semiconductor chips for mobile devices.