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v. in·ter·posed, in·ter·pos·ing, in·ter·pos·es
a. To insert or introduce between parts: The ice interposes a barrier between the harbor and the islands.
b. To place (oneself) between others or things.
2. To introduce or interject (a comment, for example) during discourse or a conversation. See Synonyms at introduce.
3. To exert (influence or authority) in order to interfere or intervene: interpose one's veto.
1. To come between things; assume an intervening position.
2. To come between the parties in a dispute; intervene.
3. To insert a remark, question, or argument.

[French, from Old French interposer, to intervene, alteration (influenced by poser, to put, place) of Latin interpōnere, to put between : inter-, inter- + pōnere, to put; see apo- in Indo-European roots.]

in′ter·pos′al n.
in′ter·pos′er n.
in′ter·po·si′tion (-pə-zĭsh′ən) n.
References in periodicals archive ?
Rumors have suggested that the manufacturing difficulties with HBM2 have centered around the interposer - specifically, the difficulty of aligning and connecting the through-silicon vias that run through the memory stacks and into the interposer itself before connecting with the GPU.
Conceivably an entire conventional circuit board with a variety of different but full-sized chips could be shrunk down onto a much smaller interposer hosting a huddle of yet far smaller chiplets.
A number of companies are considering this large-body version of FO-WLP as a lower-cost alternative to a high-density silicon interposer solution.
Both firms have agreed to work jointly to deliver standalone TSV wafers and integrated TSV solutions with metal layers for interposer and redistribution layers.
He said the company has demonstrated integrated capacitors on an interposer, thermal interface materials, and micro-bumps.
Organic interposers continue to gain momentum as an interposer option.
The spring protrudes from the interposer set bottom, while the probe protrudes from the top.
which owns cutting-edge via-fill technology for interposer substrate, to realize next-generation semiconductor packaging products using ultra-thin glass.
The Triton technology is designed to form electrodes in ultra-thin glass interposer substrates for next-generation semiconductor chips for mobile devices.
Xilinx SSI technology utilizes microbumps fabricated on the 28nm FPGA die to interface to a silicon interposer built using low-risk, high-yield 65nm technology.
Singapore, Dec 6, 2011 - (JCN Newswire) - The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology.
Unfortunately, thermal contact resistance, which limits conduction between the chip and interposer, together with limitations to effective cooling of the interposer at its edges or the outside surfaces of a chip stack package, erodes the performance of this approach.