reflowing


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reflowing

(riːˈfləʊɪŋ)
n
an occurrence of flowing again
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The method is feasible for reflowing 3D power modules that use various types of solders.
One involves separately reflowing one component on top of the primary one at the rework station or in the reflow oven.
This was part of the general increase in understanding of the total process of reflowing solder paste: evaporating solvents, activating flux chemistries and permitting time for the reduction of oxides on soldering surfaces, controlling heating rates for critical materials within the assembly, etc.
Extremely low voiding is possible because the WaferBump Oven has been specifically designed for reflowing solder bumps and solder spheres on flip chip and wafer level packaging (WLP) wafers.
This is usually the result of a non-optimized reflow profile, in which solder finishes reflowing and flux completely volatizes before reflow occurs at the solder ball.