Corrosion of PCB finished with organic solderability
preservative (OSP) proceeded by way of a uniform/pitting corrosion mechanism.
If there had been solder on the termination, the process parameters may have been correct, and problems with the pad solderability
may have been present.
the 30 g devices provide 10 N copper alloy terminal strength and solderability
for five seconds at 260[degrees]C.
Improvement of Obsolescence Electronic Components by Using Plasma Treatment Technique
Conventional organic solderability
preservative (OSP) finished PCBs were used as a reference.
This will eliminate oxidation, which harms solderability
. It also will add wetting and improve your technique.
The series offers desirable solderability
, current rating and shielded construction.
When it was developed, the focus was on solderability
and compliance to environmental regulations.
The 1995/96 testing included solderability
testing in accordance with IPC J-STD-002, surface finish oxidation assessment using Sequential Electrochemical Analysis (SERA), and ball bond/ wedge bond wirebondability testing in accordance with the MIL-STD-883D, Method 2011.7, test condition C procedures.
of the edge termination is typically caused by the lack of a protective coating like tin on the surface of the copper lead frame or resin smearing during component singulation.
The device meets safety agency standards, is full-edge terminated with nickel-gold finish for desirable solderability
and is RoHS compliant.