thermal resistance


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thermal resistance

n.
The resistance of a material or combination of materials to heat flow across a temperature gradient, usually measured in degrees Kelvin or Celsius per watt; the reciprocal of thermal conductance.
References in periodicals archive ?
In a paper to be presented at the CTI Symposium, Berlin, on 4 December, details of the development of the 6-phase, frameless, permanent magnet motor and its oil-cooled inverter with low thermal resistance, will be outlined.
The Igloo SS250 features an efficient heatsink with thermal resistance 0.235 [degrees]C/W for Multi-chip LEDs and 0.263 [degrees]C/W for single CoB.
The heat extract power is determined by the thermal resistance of the insulation [R.sub.ts], the temperature of the heated strand [T.sub.g] and the surface temperature of the wire [T.sub.p] [8]
designed a spiral coil PHC energy pile by considering the effective thermal resistance of the borehole as well as groundwater advection effects [7]; Xiang et al.
Also, the thermal performance (junction-to-ambient thermal resistance) of FOWLP with various chip thicknesses is characterized.
Solution: Fabian Menges, a researcher at IBM Research in Zurich, Switzerland, has invented a scanning probe method that measures changes to thermal resistance and variations in the rate at which heat flows through a surface.
Codes for thermal resistance also don't reflect reductions in thermal performance caused by air leakage, excluding air leakage completely in thermal resistance calculations.
The radial thermal resistance of grooves will be radically different in the evaporator and condenser sections.
Rittal says they and their related components have demonstrated their capability to operate in the toughest and most demanding environments in terms of short-circuit resistance, temperature rises, dielectric strength, thermal resistance, and use under vibration conditions.
The material has a thermal resistance that can be as low as 0.02 K/W on a 1.5-mm board, while thermal conductivity between the top surface of the one-ounce copper track and a 0.6-mm aluminum alloy heat sink can hit 152 W/mK.
Therefore, diamond is an excellent material for thermal management as it can significantly reduce overall package thermal resistance. Another strong advantage to CVD diamond is that it is engineered to have fully isotropic characteristics, enabling enhanced heat spreading in all directions.