via

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vi·a

 (vī′ə, vē′ə)
prep.
1. By way of: went to Pittsburgh via Philadelphia.
2. By means of: sent the letter via airmail.

[Latin viā, ablative of via, road; see wegh- in Indo-European roots.]

via

(ˈvaɪə)
prep
by way of; by means of; through: to London via Paris.
[C18: from Latin viā, from via way]

vi•a

(ˈvaɪ ə, ˈvi ə)

prep.
1. by a route that touches or passes through; by way of.
2. by the agency or instrumentality of; by means of: to communicate via sign language.
[1770–80; < Latin viā, abl. of via way]
ThesaurusAntonymsRelated WordsSynonymsLegend:

via

preposition
1. through, by way of, by, by means of Mr Baker will return home via Britain and France.
2. using, by means of, with the help of Translators can now work via e-mail.
Translations
عَنْ طَرِيقعَن طَريق
přes
via
kautta
preko
um, meî viîkomu á
・・・経由で
...을 거쳐
caur
prek
via
โดยทาง
yoluyla-den/dan geçerek
qua

via

[ˈvaɪə] PREPpor; (esp by plane) → vía
we drove to Lisbon via Salamancafuimos a Lisboa por Salamanca
a flight via Brusselsun vuelo vía Bruselas

via

[ˈvaɪə ˈviːə] prep
(= through) → via
We went to Paris via Boulogne → Nous sommes allés à Paris via Boulogne.
(= by means of) → par
They can work from home, via e-mail → Ils peuvent travailler de chez eux, par e-mail.

via

prepüber (+acc); (with town names also) → via; they got in via the windowsie kamen durchs Fenster herein

via

[ˈvaɪə] prep (by way of, place) → via; (person) → attraverso, tramite; (by means of) → tramite, attraverso, per mezzo di

via

(ˈvaiə) preposition
by way of. We went to America via Japan; The news reached me via my aunt.

via

عَنْ طَرِيق přes via über μέσω vía kautta via preko attraverso ・・・経由で ...을 거쳐 via via przez via через via โดยทาง yoluyla qua 经由

vi·a

n. L. vía, tracto, conducto.
References in periodicals archive ?
Check-out our latest range of microfabricated SiPM arrays with TSV (through-silicon via) and HWB (hole wire bond) technologies.
Silicon interposers with through-silicon via (TSV) are now mature products for high-performance applications, as indicated in several presentations.
The sensor's through-silicon via (TSV) design improves performance by eliminating wire bonds and provides a direct connection from the device's inputs and outputs (I/Os) to a solder ball.
But the move to wafer-level packaging, Aji said, inserts between the front end and the back end a new middle-of-the-line or "middle-end" stage, involving wafer-level through-silicon via (TSV), electrical redistribution layer (RDL), and bumping operations, with bump size and pitch decreasing, RDL line/space shrinking, and use of TSVs increasing.
Through-silicon via (TSV) has emerged as a viable and preferred technology for achieving such high-performance devices due to its short wiring length and reduced resistance and capacitance (RC) delay.
The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology.